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Af B N Milliard G. TO Collector connected to the metal part of the mounting surface Torque on nut: The point defined by the mounting-base temperature and the total dis- sipation must lie within the permissible area of operation on the curve onpageC Burrs or thickening at the edges of the four holes must be removed datashheet the transistor bolted down on a plane surface. FET enhancement mode VpigS s; 0, ll,s.

EM P t max.

Reissue of final data may be made from time to time to incorporate additional information resulting from prolonged production experience or to meet new applications. Where appropriate, other types no datashest recommended for new equipment designs, but generally available for equipment production datashret listed separately with abridged data.

These recommendations apply to a transistor mounted flush on a board having punched -through holes, or spaced at least 1. Revisions to previous data are indicated by an arrow in the margin.

AD NTE Equivalent NTE TRANSISTOR PNP GERMAN – Wholesale Electronics

The emitter voltage is negative w. The equation used is: The letter S is also used with three terminal devices as a third subscript to denote that the terminal not indicated in the subscript is shorted to the reference terminal.


Under these circumstances, the leads should be retinned using a suitable activated flux.

TO Collector connected to the metal part of the mounting surface. The BC is primarily intended for low noise audio input stages. Oms curve, and an actual duty cycle of 0. Ar162 base of the transistor is connected to the metal envelope. A further decrease of the collector -emitter voltage results in a rapid increase of the distortion of the signal.

For applications using non -square -wave pulses, reference should be made to theGeneral Explanatory Notes on SOAR where conversion to equivalent square -wave pulses is explained. Sequence of subscripts The first subscript denotes the terminal at which the current or terminal voltage is measured. The data contained in these books are as accurate and up to date as it is reasonably possible to make them at the time of going to press.

Electrical -V CES max. The leads above this point should be clamped during any lead bending operations.

Datasheeets & Application Notes

The collector lead must, in addition, be soldered to a copper area of at least 10mm x 10mm. This example describes how the SOAR curves are used to check datsheet suitability of the BD power transistors in a television audio amplifier application.

The definitions of the three systems accepted by the International Electro- technical Commission are as follows: If the application condition just exceeds the selected SOAR curve, then linear inter- polation between the family of curves used and the next lower duty cycle curves should indicate if the application is acceptable.


The BD may also be used with the BD to form a complementary pair for push-pull, audio output stages. When mounted with short side horizontal, multiply by datasueet. At low dxtasheet currents the voltage across the transistor can exceed the Vceo rating as shown in Fig. Electrical -V CBO max. Ic av max The maximum permissible average value of the total collector current.

Small signal current gain linearity A. The results obtained are with a series resistance of C. T CM maX – “’em. In the final column of Table 1values of instantaneous power are calculated and plotted against time in Fig. Mounting of ‘Lockfit’ Transistors. It is desirable to keep the stray capacities to a minimum by short lead lengths etc.

Transistors may be dip-soldered at a solder temperature of C for a maximum soldering time of 5 seconds. The temperature of the envelope.

The maximum permissible average value of the total reverse base current allowable in the reverse breakdown region. Therefore, the system for using the SOAR and transient thermal impedance curves to be described deals with this type of waveform first, and then methods for other practical cases will be considered. These recommendations apply to a transistor mounted flush on a board having punched-through holes, or spaced at least mm datashewt a board having plated-through holes.